Corrosive: Building 3D Structures

A new etching technique creates three-dimensional micro structures in silicon, which can be used for processing light signals in telecommunication applications. Tailored optical materials control the fast transmission of light signals. Yet it is very laborious to imprint silicon with the required structure, because it has to be regular and precise in all directions. "Our new production process SPRIE uses established technology, such as etching, innovative processes, such as self-organisation, and combines these in a creative manner", says Prof. Dr Martin Wegener from the Karlsruhe Institute of Technology. First, a solution of tiny polystyrene spheres is applied to a silicon surface. As the solution dries, the spheres organise themselves to form a dense, single layer and thus serve in creating a honeycomb etching mask. The etchant is a reactive plasma gas. An electric field controls whether the gas particles etch in depth or consistently in all directions. Within a few minutes, a three-dimensional, photonic crystal is created that can be used as an optical material in telecommunications.

Further Information:

Press release of the KIT

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